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| STTH8S06 Turbo 2 ultrafast high voltage rectifier Features K A Ultrafast recovery Low reverse recovery current Reduces losses in diode and switching transistor Low thermal resistance Higher frequency operation Insulated TO-220FPAC version - Insulation voltage = 1500 V rms - Package capacitance = 12 pF K A K A K TO-220AC STTH8S06D TO-220FPAC STTH8S06FP Description ST's STTH8S06 is a state of the art ultrafast recovery diode. By the use of 600 V Pt doping planar technology, this diode will out-perform the power factor corrections circuits operating in hardswitching conditions. The extremely low reverse recovery current of the STTH8S06, reduces significantly the switching power losses of the MOSFET and thus increases the efficiency of the application. This leads designers to reduce the size of their heatsinks. This device is also intended for applications in power supplies and power conversions systems, motor drive, and other power switching applications. Table 1. Device summary IF(AV) VRRM IRM(typ.) Tj (max) VF (typ) trr (typ) 8A 600 V 4.4 A 175 C 1.5 V 12 ns December 2007 Rev 1 1/8 www.st.com 8 Characteristics STTH8S06 1 Table 2. Symbol VRRM IF(AV) IFSM Tstg Tj Characteristics Absolute ratings (limiting values) Parameter Repetitive peak reverse voltage Average forward current Surge non repetitive forward current Storage temperature range Maximum operating junction temperature tp = 10 ms Value 600 8 60 -65 to + 175 175 Unit V A A C C Table 3. Symbol Rth(j-c) Thermal parameter Parameter TO-220AC Junction to case TO220FPAC 5.5 Maximum 3.0 C/W Unit Table 4. Symbol IR Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25 C Tj= 125 C Forward voltage drop Tj = 25 C Tj = 125 C VR = 600 V Min. Typ Max. 20 A 25 200 3.4 IF = 8 A V 1.5 1.9 Unit VF To evaluate the maximum conduction losses use the following equation: P = 1.20 x IF(AV) + 0.087 IF2(RMS) Table 5. Symbol trr IRM Sfactor Qrr IRM Sfactor Qrr Dynamic electrical characteristics Parameter Reverse recovery time Reverse current Softness factor Reverse recovery charges Reverse current Softness factor Reverse recovery charges I = 8 A, dIF/dt = - 200 A/s, Tj = 125 C F VR = 200 V Tj = 25 C IF = 8 A, dIF/dt = - 200 A/s, VR = 200 V Test conditions IF = 1 A, dIF/dt = - 200 A/s, VR = 30 V Min. Typ 12 1.6 1 17 4.4 0.3 90 6.0 Max. 18 2.2 Unit ns A nC A nC 2/8 STTH8S06 Characteristics Figure 1. Forward voltage drop versus forward current Figure 2. Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC) IFM(A) 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 0 1 1.0 Tj=150C (maximum values) Zth(j-c)/Rth(j-c) 0.9 0.8 Tj=150C (typical values) 0.7 0.6 Tj=25C (maximum values) 0.5 0.4 0.3 0.2 Single pulse T VFM(V) 2 3 4 5 6 7 0.1 0.0 1.E-03 1.E-02 tp(s) 1.E-01 =tp/T tp 1.E+00 Figure 3. Relative variation of thermal Figure 4. impedance junction to case versus pulse duration(TO-220FPAC) IRM(A) 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 VR=200V Tj=125C Peak reverse recovery current versus dIF/dt (typical values) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 Zth(j-c)/Rth(j-c) IF=2 x IF(AV) IF=IF(AV) IF=0.5 x IF(AV) =0.5 =0.2 =0.1 T Single pulse tp(s) 1.E-02 1.E-01 =tp/T 1.E+00 tp dIF/dt(A/s) 0 200 400 600 800 1000 0.0 1.E-03 1.E+01 3/8 Characteristics STTH8S06 Figure 5. trr(ns) 70 Reverse recovery time versus dIF/dt Figure 6. (typical values) Qrr(nC) 240 VR=200V Tj=125C Reverse recovery charges versus dIF/dt (typical values) IF=2 x IF(AV) 220 200 180 60 50 IF=2 x IF(AV) VR=200V Tj=125C IF=IF(AV) 160 IF=IF(AV) IF=0.5 x IF(AV) 40 30 20 10 140 120 100 80 60 40 IF=0.5 x IF(AV) dIF/dt(A/s) 0 0 200 400 600 800 1000 20 0 0 200 dIF/dt(A/s) 400 600 800 1000 Figure 7. Junction capacitance versus reverse voltage applied (typical values) C(pF) 100 F=1MHz VOSC=30mVRMS Tj=25C 10 VR(V) 1 1 10 100 1000 4/8 STTH8S06 Package information 2 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.4 to 0.6 N*m In order to meet environmental requirements, ST (also) offers these devices in ECOPACK(R) packages. ECOPACK(R) packages are Lead-free. The category of second level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 6. TO-220AC dimensions Dimensions Ref. Millimeters Min. A H2 OI L5 L7 L6 L2 C A Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40 4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00 C D E F F1 G F1 L9 L4 F D H2 L2 L4 16.40 typ. 13.00 2.65 15.25 6.20 3.50 14.00 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 M E G L5 L6 L7 L9 M Diam. I 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 5/8 Package information STTH8S06 Table 7. TO-220FPAC dimensions Dimensions Ref. Millimeters Min. A A H B Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.205 0.106 0.409 Max. 4.6 2.7 2.75 0.70 1 1.70 5.20 2.7 10.4 4.4 2.5 2.5 0.45 0.75 1.15 4.95 2.4 10 B D E Dia F L6 L2 L3 L5 F1 L4 D L7 F1 G G1 H L2 L3 16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20 0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126 F G1 G E L4 L5 L6 L7 Dia. 6/8 STTH8S06 Ordering information 3 Ordering information Table 8. Ordering information Marking STTH8S06D STTH8S06FP Package TO-220AC TO-220FPAC Weight 1.9 g 1.64 g Base qty 50 50 Delivery mode Tube Tube Order code STTH8S06D STTH8S06FP 4 Revision history Table 9. Date 18-Dec-2007 Document revision history Revision 1 First issue. Description of changes 7/8 STTH8S06 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 |
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